Processor package cover plate



FIG. 1 is a perspective view of a processor package cover plate including an indented area on a surface of the processor package cover plate, the flat region at the bottom of the indented area comprising a holographic image represented by oblique line shading;

FIG. 2-4 are front, top, and back views, respectively, of the processor package cover plate, the flat region at the bottom of the indented area in FIG. 2 comprising a holographic image represented by oblique line shading;

FIG. 5-7 are right, left, and bottom views, respectively, of the processor package cover plate; and,

FIG. 8 is a cross-sectional view of the processor package cover plate taken along line 8-8 of FIG. 2.

The processor package is shown in broken lines in the views for illustrative purposes only and forms no part of the claimed design. 

The ornamental design for a processor package cover plate, as shown and described. 